Greeting from Professor

It is very honorable to meet our friends in this explosively expanding AI & Internet world, empowered by super-fast semiconductors. SPAI laboratory at Sejong unversity is pioneering advanced packaging, signal/power integrity, EMI/EMC, hardware security, AI-based packaging EDA to realize high-performance semiconductor systems for various applications such as AI, data-center servers, and mobility.

To me, packaging is not only for interconnecting various devices, but also integrating various people with different cultures and backagrounds to realize someting exciting and fruitful "stuffs" not limited to researches.

"PI4X: Packaging and Interconnection for X"

Lab History

Click “here” for the detailed lab history