SPAI laboratory at sejong unversity is focusing on advanced package development, signal/power integrity, EMI/EMC, hardware security, and AI-based packging EDA. Research topics of our lab include but not limited to the below.

(1) Advanced packaging for 2.5D/3D custom Integration
(2) Signal/Power Integrity Co-design
(3) Hardware security realization based on packaging and EMC technologies
(4) AI-based Package-EDA