International Conferences

1. Youngwoo Kim, Changhoon Lee, Daisuke Fujimoto, and Yuichi Hayashi, “Simulation and Analysis of Intentional EMI Attack Against Power Delivery Network of Ring Oscillator based True Random Number Generator”, 2025 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity, Raleigh-Durham, North Carolina, USA, August 19th, 2025.
2. Youngwoo Kim, "Signal and Power Integrity Design for Advanced Packages", The 21st International Symposium on the Physics of Semiconductor Applications (ISPSA), Jeju, Korea, Jun 3 2024.
3. Youngwoo Kim, "Secured Power Delivery Network Design for Cryptographic Devices", 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan/Asia-Pacific International Symposium on Electromagnetic Compatibility, Okinawa, Japan, May 20, 2024.
4. Youngwoo Kim, Taiki Kitazawa, Yuichi Hayashi, "EMI and Intentional-EMI Attacks against Power Delivery Network of Crypto/Information Devices", DesignCon 2024, Santa Clara, CA, USA, February 1, 2024. 
5. Youngwoo Kim, Fujimoto Daisuke, Shinpei Wada, Taiki Kitazawa, and Yuichi Hayashi,  "How to Design Secured Power Delivery Network of Cryptographic Devices: Challenges, Evaluation Methods, and Solutions", DesignCon 2023, Santa Clara, CA, USA, February 1 2023, Best Paper Award.
6. Taiki Kitazawa, Yuichi Hayashi, Yoshi Fukawa, Youngwoo Kim, “Analysis of the PDN Induced Crosstalk Impacts on the High-speed Signaling in Ultra-thin and High Permittivity Substrates,” International Symposium and Exhibition on Electromagnetic Compatibility 2022 (EMC Europe), Gothenburg, Sweden, September 6, 2022.
7. Youngwoo Kim, “Interposer Channel Design based on Statistical Signal/Power Integrity Co-analysis,” 2022 Asia Pacific International Symposium on Electromagnetic Compatibility (APEMC), Hybrid (Beijing, China & On-line), September 2, 2022.
8. Daisuke Fujimoto, Youngwoo Kim, Masanori Hashimoto, Naofumi Homma, and Yuichi Hayashi, “SASIMI: Evaluation Board for EM Information Leakage from Large Scale Cryptographic Circuit,” 2022 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity, Spokane, Washington, USA, August 3, 2022.
9. Taiki Kitazawa, Yoshiki Kitamura, Youngwoo Kim, Daisuke Fujimoto, Hideaki Sone, and Yuichi Hayashi, “TEMPEST Attack Against High-resolution Displays using Differences in the Transfer Function of EM Waves,” 3rd International Union of Radio Science (URSI) Atlantic/Asia Pacific Radio Science Meeting (AT-AP-RASC2022), Hybrid (Gran Canaria, Spain & On-line), May 31, 2022.
10. Hikaru Nishiyama, Daisuke Fujimoto, Youngwoo Kim, Hieaki Sone, and Yuichi Hayashi, “IEMI Fault Injection Method using Continuous Sinusoidal Wave with Controlled Frequency, Amplitude, and Phase,” The 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), On-line, March 11th, 2022.
11. Youngwoo Kim, Shinpei Wada, Daisuke Fujimoto, and Yuichi Hayashi, "Analysis of Filtering Window Impacts on Estimation Accuracy of Information Leakage from Exposed Power Delivery Network of Cryptographic Devices," The 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), On-line, March 11th, 2022.
12. Youngwoo Kim, Shinpei Wada, Daisuke Fujimoto, and Yuichi Hayashi, "Analysis of Electromagnetic Information Leakage from Overdesigned Power Delivery Network of Cryptographic Devices," 2021 Asia Pacific International Symposium on Electromagnetic Compatibility, Hybrid (Bali & On-line), September 28, 2021.
13. Shugo Kaji, Daisuke Fujimoto, Youngwoo Kim, and Yuichi Hayashi, "A Fundamental Evaluation of EM Information Leakage Induced by Intentional Electromagnetic Interference Against Differential Signal Device," 2021 Asia Pacific International Symposium on Electromagnetic Compatibility, Hybrid (Bali & On-line), September 28, 2021.
14. Youngwoo Kim, Daisuke Fujimoto, and Yu-ichi Hayashi, “Analysis of HDMI 2.1 Mated Connector Contact Boundary Impedance Impacts on a High-speed Digital System Performance”, Accepted to 30th International Conference on Electrical Contacts, St. Gallen-Rorschach, Switzerland, June, 2020 – Delayed 1 year due to COVID19, June 11, 2021.
15. Youngwoo Kim, “Feasibility Analysis of Over 20 Gb/s HDMI Signaling using Passive Connector and Cable Assembly”, in Proceedings of IEEE The 13th Global Symposium on Millimeter-Waves & THz (GSMM), Hybird (On-line & On-site: Nanjing, China), May 25, 2021. (Invited Paper)
16. Youngwoo Kim, “Statistical Analysis and Modeling of a High Bandwidth Memory (HBM) Interposer Channel”, IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization, Hangzhou, China (& On-line), December 8, 2020. (Invited Paper)
17. Seungtaek Jeong, Seongsoo Lee, Seokwoo Honh, Boogyo Shim, Hyunwook Park, Subin Kim, Youngwoo Kim, Jeeyeong Son, Joungho Kim, Jaehak Lee, and Junyeob Song, “Design, Simulation and Measurement of a Flexible Voltage-controlled Oscillator (VCO) Chip with Bending Radius”, in Proceedings of the 29th Conference on Electrical Performance of Electronic Packaging and Systems, Virtual, October 7, 2020.
18. Shinpei Wada, Youngwoo Kim, Daisuke Fujimoto, Naofumi Homma, and Yu-ichi Hayashi, “Efficient Electromagnetic Analysis based on Side-Channel Measurement Focusing on Physical Structures”, in Proceedings of the 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity (EMCSI), Reno, Nevada, USA, August 19, 2020.  
19. Youngwoo Kim, Yu-ichi Hayashi, Fujimoto Daisuke, Hyunwook Park, and Joungho Kim, “Statistical Signal/Power Integrity Analysis of High-Bandwidth Memory (HBM) Interposer Channel considering SSO Noise and Data Coding”, in Proceedings of the DesignCon 2020, Santa Clara, CA, USA, January 30, 2020
20. Gapyeol Park, Kyungjun Cho, Kyungjune Son, Hyunwook Park, Daehwan Lho, Seongguk Kim, Taein Shin, Youngwoo Kim, and Joungho Kim, “Design and Measurement of a 28 GHz Glass Band Pass Filter based on Glass Interposers for 5G Applications”, in Proceedings of the 2019 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Kaohsiung, Taiwan, December 17, 2019. (Best Student Paper Award)
21. Hikaru Nishiyama, Takumi Okamoto, Youngwoo Kim, Daisuke Fujimoto, and Yu-ichi Hayashi, “Fundamental Study on Influence of Intentional Electromagnetic Interference on IC Communication”, in Proceedings of the 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Haining, Hangzhou, China, October 23, 2019.
22. Youngwoo Kim, Daisuke Fujimoto, Hikaru Nishiyama, Daehwan Lho, Hyunwook Park, Joungho Kim, and Yu-ichi Hayashi, “Statistical Analysis of Simultaneous Switching Output (SSO) Impacts on Steady State Output Responses and Signal Integrity”, in Proceedings of the 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Haining, Hangzhou, China, October 22, 2019.
23. Seungtaek Jeong, Subin Kim, Youngwoo Kim, Shinyoung Park, Hyunwook Park, and Joungho Kim, "Design and Analysis of Flexible Interconnects on an Extremely Thin Silicon Substrate for Flexible Wearable Devices", in Proceedings of the 2019 Joint International Symposium on Electromagnetic compatibility and Asia-Pacific International Symposium on Electromagnetic compatibility, Sapporo, Jun 5, 2019.
24. Subin Kim, Kyungjun Cho, Youngwoo Kim, Shinyoung Park, Hyunwook Park, Seungtaek Jeong and Joungho Kim, "Power Integrity Analysis of Interposer-level Integrated Voltage Regulator for Next Generation High Bandwidth Memory", in Proceedings of the 2019 Joint International Symposium on Electromagnetic compatibility and Asia-Pacific International Symposium on Electromagnetic compatibility, Sapporo, Jun 4, 2019.
25. Kyungjun Cho, Youngwoo Kim, Junyong Park, Hyesoo Kim, Seongguk Kim, Subin Kim, Gapyeol Park, Kyungjune Son and Joungho Kim, "Modeling and Analysis of Multiple Coupled Through-Silicon Vias (TSVs) for 2.5-D/3-D ICs", in Proceedings of the 2019 Joint International Symposium on Electromagnetic compatibility and Asia-Pacific International Symposium on Electromagnetic compatibility, Sapporo, Japan, June 5, 2019. (Best Student Paper Award)
26. Mumpy Das, Seungtaek Jeong, Boogyo Sim, Seongsoo Lee, Seokwoo Hong, Youngwoo Kim, and Joungho Kim, "Study of Series-series Topology for Suppressing Electromagnetic Interference (EMI) for Digital TV Wireless Power Transfer (WPT) System", in Proceedings of the 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Taj Chandigarh, India, December 16, 2019.
27. Youngwoo Kim, Kyungjun Cho, Junyong Park, Shinyoung Park, Kyunghwan Song, Seungyoung Ahn, and Joungho Kim, “Statistical Signal Integrity Analysis of High-Bandwidth Memory (HBM) Interposer Channel considering Non-linear Power/Ground Noise and SSO Noise”, in Proceedings of the DesignCon 2018, Santa Clara, CA, USA, January 30, 2019.
28. Kyunjun Cho, Youngwoo Kim, Subin Kim, Gapyeol Park, Kyungjune Son, Hyunwook Park, Seongguk Kim, Sumin Choi, Dong-Hyun Kim, and Joungho Kim, "Modeling of Through-silicon Via (TSV) with an Embedded High-density Metal-insulator-metal (MIM) Capacitor", in Proceedings of the 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Taj Chandigarh, India, December 16, 2018.
29. Gapyeol Park, Youngwoo Kim, Kyungjun Cho, Junyong Park, Kyungjune Son, Hyunwook Park, Atom Watanabee, Pulugurtha Markondeya Raj, Venky Sundaram, Rao Tummala, and Joungho Kim, "Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module", in Proceedings o the 27th Conference on Electrical Performance of Electronic Packaging and Systems, San Jose, CA, USA, October 15, 2018.
30. Subin Kim, Youngwoo Kim, Kyungjun Cho, Jinwook Song, Shinyoung Park, Junyong Park, Hyunwook Park, Seungtaek Jeong, and Joungho Kim, "Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface", in Proceedings of the 27th Conference on Electrical Performance of Electronic Packaging and Systems, San Jose, CA, USA, October 16, 2018.
31. Youngwoo Kim, Kyungjun Cho, Gapyeol Park, Seungtaek Jeong, and Joungho Kim, “Electrical Performance Analysis of Glass Interposer Channel and Power Distribution Network”, in Proceedings of the 27th Conference on Electrical Performance of Electronic Packaging and Systems, San Jose, CA, USA, October 15, 2018. (Invited Paper)
32. Junyong Park, Dong-Hyun Kim, Youngwoo Kim, Sumin Choi, and Joungho Kim, “Eye-Diagram Estimation with Stochastic Model for 8B/10B Encoded High-Speed Channel”, in Proceedings of the 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Singapore, Singapore, June 25, 2018.
33. Dong-Hyun Kim, Subin Kim, Junyong Park, Youngwoo Kim, Sumin Choi, Kyungjun Cho, and Joungho Kim, “Bias-dependent Power Distribution Network Impedance Analysis with MOS Capacitor”, in Proceedings of the 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Singapore, Singapore, June 25, 2018.
34. Shinyoung Park, Jinwook Song, Subin Kim, Youngwoo Kim, and Joungho Kim, “How to Manage TDMA Power Amplifier Switching Noise Coupling to Audio CODECs in Mobile Phones”, in Proceedings of the DesignCon 2018, Santa Clara, CA, USA, January 31, 2018.
35. Youngwoo Kim, Kyungjun Cho, Gapyeol Park, Shinyoung Park, Seungyoung Ahn, and Joungho Kim, “Electrical Performance Analysis of Low-Cost and Ultra-Thin Glass Interposer: Advantages, Challenges and Solutions”, in Proceedings of the DesignCon 2018, Santa Clara, CA, USA, January 31, 2018.
36. Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee, Gapyeol Park, Subin Kim, Kyungjune Son, Sumin Choi, and Joungho Kim, “Signal and Power Integrity (SI/PI) Analysis of Heterogeneous Integration Using Embedded Multi-die Interconnect Bridge (EMIB) Technology for High Bandwidth Memory (HBM)”, in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium, Haining, Hangzhou, China, December 16, 2017.
37. Gyeyoung Park, Jinwook Song, Seungtaek Jung, Youngwoo Kim ,Hyunwoo Shim, and Joungho Kim, "Analysis of Power Inverter Parasitic Inductances Effect on Switching Characteristics for Accurate Electromagnetic Interference (EMI) Estimation", in Proceedings of the 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, Washington D.C., USA, August 9, 2017.
38. Gapyeol Park, Youngwoo Kim, Kyungjun Cho, Minsuk Kim, Pulugurtha Markondeya Raj, Venky Sundaram, Rao Tummala and Joungho Kim, "Design and Analysis of Receiver Channels of Glass Interposer for Dual Band Wi-Fi Front End Module (FEM)", in Proceedings of the 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, Washington D.C., USA, August 9, 2017.
39. Subin Kim, Youngwoo Kim, and Joungho Kim, "Design and Analysis of On-chip Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in Mobile AP", in Proceedings of the 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, Seoul, Korea, June 22, 2017.
40. Youngwoo Kim, Kyungjun Cho, Gapyeol Park, Subin Kim and Joungho Kim, "Hierarchical Power Distribution Network Design in Fanout Wafer Level Package based Mobile AP-GPU for Multi-Media System", in Proceedings of the 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, Seoul, Korea, June 22, 2017.
41. Junyong Park, Jonghoon J. Kim, Sumin Choi, Youngwoo Kim, Heegon Kim, and Joungho Kim, "Eye-Diagram Estimation Methods for Voltage- and Probability-dependent PAM4 Signal on Stacked on Through-Silicon Vias (TSVs)", in Proceedings of the Electronic Components and Technology Conference 2017, Orlando, FL, USA, May 30, 2017.
42. Kyungjun Cho, Hyunsuk Lee, Heegon Kim, Youngwoo Kim, Sumin Choi, Subin Kim, Hyungsoo kim, and Joungho Kim, "Design and analysis of high bandwidth memory (HBM) interposer Considering Signal and Power integirty (SI/PI) for terabyte/s bandwidth system", in Proceedings of the DesignCon 2017, Santa Clara, CA, USA, January 30, 2017.
43. Youngwoo Kim, Kyungjun Cho, Gapyeol Park, Subin Kim, Kibum Kang, Kwangsup So, Jiwon Jeon, Chungju Kim, Woohyun Paik, and Joungho Kim, "Power and Signal Integrity Analysis of Fan-out Wafer Level Package for Mobile Application Processor", in Proceedings of the DesignCon 2017, Santa Clara, CA, USA, January 30, 2017.
44. Youngwoo Kim, Kyungjun Cho, Subin Kim, Gapyeol Park and Joungho Kim, "Power/Ground Noise Coupling Comparison and Analysis in Silicon, Organic and Glass Interposers", in Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium, Honolulu, HI, USA, December 15, 2016.
45. Subin Kim, Youngwoo Kim, Kyungjun Cho, Jinwook Song, and Joungho Kim, "Design and Analysis of On-interposer Active Power Dsitribution Network for an Efficient Simultaneous Switching Noise", in Proceedings of the IEEE International Conference on 3D Systems Integration (3D IC 2016), San Francisco, CA, USA, November 11, 2016.
46. Kyungjun Cho, Youngwoo Kim, Subin Kim, Hyunsuk Lee, Sumin Choi, Heegon Kim and Joungho Kim, "Power Distribution Network (PDN) Design and Analysis of A Single and Double-Sided High Bandwidth Memory (HBM) Interposer for 2.5D Terabtye/s Bandwidth System", in Proceedings of the IEEE International Conference on Signal and Power Integrity (SIPI 2016) An embedded conference within the IEEE International Symposium on Electromagnetic Compatibility, Ottawa, Canada, July 27, 2016.
47. Youngwoo Kim, Heegon Kim, Jonghyun Cho, Kibum Kang, Taisik Yang, Woohyun Paik, and Joungho Kim, "Mobile AP GPU Power Distribution Network Simulation and Analysis based on Chip Power Model", in Proceedings of the IEEE International Conference on Signal and Power Integrity (SIPI 2016) An embedded conference within the IEEE International Symposium on Electromagnetic Compatibility, Ottawa, Canada, July 27, 2016.
48. Atom Watanabe, Junki Min, Markondeya R. Pulugurtha, Seungtaek Jeong, Subin Kim, Youngwoo Kim, Joungho Kim, Deny Wong, Ravi Mullapudi, and Rao Tummala, “Highly-effective Integrated EMI Shields with Graphene and Nanomagnetic Multilayered Composites”, in Proceedings of the 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 31, 2016.
49. Kyungjun Cho, Youngwoo Kim, Hyungsuk Lee, Heegon Kim, Sumin Choi, Subin Kim and Joungho Kim, "Design and Analysis of Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module", in Proceedings of the 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 31, 2016.
50. Yeseul Jeon, Heegon Kim, Sumin Choi, Youngwoo Kim, and Joungho Kim, "Design of an On-interposer Passive Equalizer for High Bandwidth Memory (HBM) with 30Gbps Data Transmission", in Proceedings of the 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 31, 2016.
51. Youngwoo Kim, Jinwook Song, Subin Kim, Venky Sundaram, Rao Tummala, Jonghyun Cho, and Joungho Kim, "Electromagnetic Bandgap Design for Power Distribution Network Noise Isolation in the Glass Interposer", in Proceedings of the 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 31, 2016.
52. Youngwoo Kim, Heegon Kim, Jonghyun Cho, Kibum Kang, Taisik Yang, Woohyun Paik, and Joungho Kim, "Design of a Mobile AP GPU PDN based on Chip Power Model and Measurement", in Proceedings of the DesignCon 2016, Santa Clara, CA, USA, January 19, 2016.
53. Insu Hwang, Jihye Kim, Youngwoo Kim, Jonghyun Cho, and Joungho Kim, "Analysis of through glass via (TGV) noise coupling effect to Noise Figure of 2.4GHz LNA on glass interposer", in Proceedings of the IEEE Electrical Design of Advanced Packaging & System Symposium, Seoul, Korea, December 14, 2015.
54. Jihye Kim, Insu Hwang, Youngwoo Kim, Heegon Kim, and Joungho Kim, "Electrical Characteristics Analysis and Comparison between Through Silicon Via (TSV) and Through Glass Via (TGV)", in Proceedings of the IEEE Electrical Design of Advanced Packaging & System Symposium, Seoul, Korea, December 14, 2015.
55. Yeseul Jeon, Heegon Kim, Sumin Choi, Jinwook Song, Youngwoo Kim, and Joungho Kim, "Design of an On-interposer Passive Equalizer Embedded on a Ground Plane for 30Gbps Serial Data Transmission", in Proceedings of the IEEE Electrical Design of Advanced Packaging & System Symposium, Seoul, Korea, December 14, 2015.
56. Junyong Park, Hyesoo Kim, Youngwoo Kim, Jonghoon J. Kim, Bumhee Bae, Dongho Ha, Michael Bae, and Joungho Kim, “Analysis of External Force Dependent Lumped RLGC Model of High-bandwidth and High-density Silicone Rubber Socket”, in Proceedings of the IEEE Electrical Design of Advanced Packaging & System Symposium, Seoul, Korea, December 14, 2015.
57. Kyungjun Cho, Hyunsuk Lee, Heegon Kim, Sumin Choi, Youngwoo Kim, Jaemin Lim and Joungho Kim, "Design Optimization of High Bandwidth Memory (HBM) Interposer considering Signal Integrity", in Proceedings of the IEEE Electrical Design of Advanced Packaging & System Symposium, Seoul, Korea, December 14, 2015.
58. Youngwoo Kim, Kiyeong Kim, Jonghyun Cho, and Joungho Kim, "Power Distribution Network Design and Optimization based on Frequency Dependent Target Impedance", in Proceedings of the IEEE Electrical Design of Advanced Packaging & System Symposium, Seoul, Korea, December 14, 2015.
59. Insu Hwang, Jihye Kim, Youngwoo Kim, Jonghyun Cho, Venky Sundaram, Rao Tummala and Joungho Kim, "Noise Coupling Modeling and Analysis of Through Glass Via(TGV)", in Proceedings of the IEEE International 3D Systems Integration Conference (3DIC), Sendai, Japan, August 31, 2015.
60. Jihye Kim, Insu Hwang, Youngwoo Kim, Jonghyun Cho, Venky Sundaram, Rao Tummala, and Joungho Kim, "Precise RLGC Modeling and Analysis of Through Glass Via(TGV) for 2.5D/3D IC", in Proceedings of the 65th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 26, 2015.
61. Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Venky Sundaram, Rao Tummala and Joungho Kim, “Signal and Power Integrity Analysis in 2.5D Integrated Circuits (ICs) with Glass, Silicon and Organic Interposer”, in Proceedings of the IEEE Electronic Components and Technology Conference (ECTC), 2015., San Diego, CA, USA, May. 2015.
62. Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Srikrishna Sitaraman, Venky Sundaram, Rao Tummala and Joungho Kim, "Analysis and Optimization of a Power Distribution Network in 2.5D IC with Glass Interposer", in Proceedings of the IEEE International 3D Systems Integration Conference, Cork, Ireland, December 1, 2014.
63. Eunseok Song, Daniel H. Jung, Youngwoo Kim, and Joungho Kim, "Measurement and Analysis of Wireless Power Distribution Network using Magnetic Field Resonance in 3D Package and IC", in Proceedings of the 2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan, December 5, 2014.
64. Youngwoo Kim, Kiyeong Kim, Jonghyun Cho, Venky Sundaram, Rao Tummala and Joungho Kim, "Analysis of Power Distribution Network in Glass, Silicon Interposer and PCB", in Proceedings of the 2014 IEEE International Symposium on Electromagnetic Compatibility, Raleigh, NC, USA, August 5, 2014.
65. Heegon Kim, Hyunsuk Lee, Jonghyun Cho, Youngwoo Kim and Joungho Kim, "Electrical Design of silicon, glass and organic interposer channels," in Proceedings of the 2014 Pan Pacific Microelectronics Symposium, Kauai, Hawaii, USA, February 3, 2014.
66. Jonghyun Cho, Youngwoo Kim, Venky Sundaram, Rao Tummala, and Joungho Kim, "Analysis of Glass Interposer PDN and Proposal of PDN Resonance Suppression Methods," in Proceedings of the IEEE International 3D Systems Integration Conference, San Francisco, CA, USA, October 3, 2013.