Youngwoo Kim
Associate Professor, Sejong University, Korea
Department of Semiconductor System Engineering,
1109 Gwanggaeto-gwan, 209 Neungdong-ro, Gwangjin-gu, Seoul, Korea (PO 05006)
Email: youngwoo at sejong.ac.kr       Office: +82-2-3408-3506
Dr. Kim's personal HP

Education

• Ph.D., Korea Advanced Institute of Science and Technology (KAIST), Electrical Engineering, Tera-lab, 2015.03 ~ 2018.08 (EE Top Achievement 2017)
• M.S., Korea Advanced Institute of Science and Technology (KAIST), Electrical Engineering, Tera-lab, 2013.03 ~ 2015.02
• B.S., Korea University, Electrical Engineering, 2009.03 ~ 2013.02 (with Honor)

Professional Experience

• Associate Professor, Department of Semiconductor System Engineering, Sejong University, Korea, 2024.09 ~ Present
• Vice Provost, Sejong University, Korea, 2025.03 ~ Present
• Assistant Professor, Department of Semiconductor System Engineering, Sejong University, Korea, 2023.03 ~ 2024.08
• Assistant Professor, Division of Information Science, Nara Institute of Science and Technology (NAIST), Japan, 2019.07 ~ 2023.02
• Post-doctoral Researcher, Institute of Information and Electronics, KAIST, 2018.09 ~ 2019.06
• Graduate Research Assistant, School of Electrical Engineering, KAIST, 2013.03 ~ 2018.08
• Technical Consultant, Invecas Inc. (USA & India), Specialized in signal/power integrity for AI-core, SoC, SerDes, LPDDR, and HDMI, 2018.01 ~ 2019.06
• Technical Consultant, Lattice Semiconductor (USA), Specialized in signal/power integrity for HDMI, 2017.01 ~ 2017.09
• Standard Activity, HDMI Forum, Specialized in connectors and cables, 2017.01 ~ 2019.06
• Technical Consultant, Analog Device Inc. (USA), 2025.07~

Professional Activities & Services

• Associate Editor, IEEE Transactions on Components, Packaging, and Manufacturing Technology (TCPMT), 2020.11 ~ Present
• Best Paper Awards Review Committee, IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2020.
• Technical Program Committee Member, IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), 2020.
• Technical Program Committee Member & Special Session Organizer & Reviewer, 2022 Asia Pacific International Symposium on Electromagnetic Compatibility (APEMC)
• Technical Program Committee Member & Reviewer, 7th IEEE Global EMC Conference (GEMCon) 2023.
• Technical Program Committee Member & Reviewer, 2024 Asia-Pacific Microwave Conference
• Technical Program Committee Member & Reviewer, Asian Hardware Oriented Security and Trust (AsianHOST) 2024.
• Technical Program Committee Member & Reviewer, 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity
• Technical Program Committee Member & Reviewer, 2025 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity

Journal Reviewer:

• IEEE Transactions on Electromagnetic Compatibility (TEMC)
• IEEE Transactions on Components, Packaging, and Manufacturing Technology (TCPMT)
• IEEE Transactions on Microwave Theory and Techniques (TMTT)
• IEEE Microwave and Wireless Components Letters (MWCL)
• IEEE Transactions on Computer-aided Design on Integrated Circuits and Systems (TCAD)
• IEEE Transactions on Circuits and Systems I (TCAS I)
• IEEE Transactions on Power Electronics (TPE)
• IEEE Access
• IEEE Transactions on Signal Integrity and Power Integrity (TSIPI)
• Journal of Electromagnetic Waves and Applications
• Wiley Microwave and Optical Technology Letters
• MDPI Journals: Applied Science/ Energies/ Electronics/ Symmetries
• Hindawi Journal

Society Memberships

• Senior Member of IEEE (EMC Society, Advanced Packaging Society, Microwave Theory and Techniques Society)
• Member of Young Engineer Honor Society, NAEK (National Academy of Engineering of Korea, 한국공학한림원)
• Life Member of the Korean Institute of Electromagnetic Engineering and Science (KIEES, 한국전자파학회 종신회원)
• Life Member of the Korean Microelectronic and Packaging Society (KMEPS, 한국마이크로전자 및 패키징학회 종신회원 & 학술이사)